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Lih-Tyng Hwang 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility


An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

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Arvind Raghavan Modeling and Design Techniques for RF Power Amplifiers


Achieve higher levels of performance, integration, compactness, and cost-effectiveness in the design and modeling of radio-frequency (RF) power amplifiers RF power amplifiers are important components of any wireless transmitter, but are often the limiting factors in achieving better performance and lower cost in a wireless communication system—presenting the RF IC design community with many challenges. The next-generation technological advances presented in this book are the result of cutting-edge research in the area of large-signal device modeling and RF power amplifier design at the Georgia Institute of Technology, and have the potential to significantly address issues of performance and cost-effectiveness in this area. Richly complemented with hundreds of figures and equations, Modeling and Design Techniques for RF Power Amplifiers introduces and explores the most important topics related to RF power amplifier design under one concise cover. With a focus on efficiency enhancement techniques and the latest advances in the field, coverage includes: Device modeling for CAD Empirical modeling of bipolar devices Scalable modeling of RF MOSFETs Power amplifier IC design Power amplifier design in silicon Efficiency enhancement of RF power amplifiers The description of state-of-the-art techniques makes this book a valuable and handy reference for practicing engineers and researchers, while the breadth of coverage makes it an ideal text for graduate- and advanced undergraduate-level courses in the area of RF power amplifier design and modeling.

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Pierre Jarry Advanced Design Techniques and Realizations of Microwave and RF Filters


The fundamentals needed to design and realize microwave and RF filters. Microwave and RF filters play an important role in communication systems and, owing to the proliferation of radar, satellite, and mobile wireless systems, there is a need for design methods that can satisfy the ever-increasing demand for accuracy, reliability, and shorter development times. Beginning with a brief review of scattering and chain matrices, filter approximations and synthesis, waveguides and transmission lines, and fundamental electromagnetic equations, the book then covers design techniques for microwave and RF filters operating across a frequency range from 1 GHz to 35 GHz. Each design chapter: Is dedicated to only one filter and is organized by the type of filter response Provides several design examples, including the analysis and modeling of the structures discussed and the methodologies employed Offers practical information on the actual performance of the filters and common difficulties encountered during construction Concludes with the construction technique, pictures of the inside and outside of the filter, and the measured performances Advanced Design Techniques and Realizations of Microwave and RF Filters is an essential resource for wireless and telecommunication engineers, as well as for researchers interested in current microwave and RF filter design practices. It is also appropriate as a supplementary textbook for advanced undergraduate courses in filter design.

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Hueber Gernot Multi-Mode / Multi-Band RF Transceivers for Wireless Communications. Advanced Techniques, Architectures, and Trends


Summarizes cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Includes original contributions from distinguished researchers and professionals. Covers cutting-edge physical layer technologies for multi-mode wireless RF transceivers. Contributors are all leading researchers and professionals in this field.

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Hattie Tyng Tyng Griswold Home Life of Great Authors

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Группа авторов Multi-dimensional Imaging


Provides a broad overview of advanced multidimensional imaging systems with contributions from leading researchers in the field Multi-dimensional Imaging takes the reader from the introductory concepts through to the latest applications of these techniques. Split into 3 parts covering 3D image capture, processing, visualization and display, using 1) a Multi-View Approach and 2.) a Holographic Approach, followed by a 3rd part addressing other 3D systems approaches, applications and signal processing for advanced 3D imaging. This book describes recent developments, as well as the prospects and challenges in advances in imaging sciences and engineering such as 3D image sensing, 3D holographic imaging, imaging applications for bio-photonics and 3D image recognition. Advanced imaging systems incorporate knowledge from various fields. It is a complex technology that combines physics, optics, signal processing, and image capture techniques. Provides a broad overview of advanced multidimensional imaging systems with contributions from leading researchers in the field. Integrates the background, introductory material with new advances in 3D imaging and applications. Covers the most recent technologies such as high speed digital holography, compressive sensing, real-time 3D integral imaging, 3D TV, photon counting imaging. To be available as an enhanced ebook with added functionality of colour films showing the effects of advanced 3D applications such as 3D microscopy, 3D biomedical imaging and 3D for security and defense applications. Acts as a single source reference to the rapidly developing field of 3D imaging technology. Provides supplementary material on a companion website including video clips, examples, numerical simulations, and experimental results to show the theoretical concepts. With contributions from leading researchers from across these fields, Multi-dimensional Imaging is a comprehensive reference for the imaging technology research community.

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Steven Voldman H. ESD


With the growth of high-speed telecommunications and wireless technology, it is becoming increasingly important for engineers to understand radio frequency (RF) applications and their sensitivity to electrostatic discharge (ESD) phenomena. This enables the development of ESD design methods for RF technology, leading to increased protection against electrical overstress (EOS) and ESD. ESD: RF Technology and Circuits: Presents methods for co-synthesizisng ESD networks for RF applications to achieve improved performance and ESD protection of semiconductor chips; discusses RF ESD design methods of capacitance load transformation, matching network co-synthesis, capacitance shunts, inductive shunts, impedance isolation, load cancellation methods, distributed loads, emitter degeneration, buffering and ballasting; examines ESD protection and design of active and passive elements in RF complementary metal-oxide-semiconductor (CMOS), RF laterally-diffused metal oxide semiconductor (LDMOS), RF BiCMOS Silicon Germanium (SiGe), RF BiCMOS Silicon Germanium Carbon (SiGeC), and Gallim Arsenide technology; gives information on RF ESD testing methodologies, RF degradation effects, and failure mechanisms for devices, circuits and systems; highlights RF ESD mixed-signal design integration of digital, analog and RF circuitry; sets out examples of RF ESD design computer aided design methodologies; covers state-of-the-art RF ESD input circuits, as well as voltage-triggered to RC-triggered ESD power clamps networks in RF technologies, as well as off-chip protection concepts. Following the authors series of books on ESD, this book will be a thorough overview of ESD in RF technology for RF semiconductor chip and ESD engineers. Device and circuit engineers working in the RF domain, and quality, reliability and failure analysis engineers will also find it a valuable reference in the rapidly growing are of RF ESD design. In addition, it will appeal to graduate students in RF microwave technology and RF circuit design.

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan. A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments. Readers are introduced to the markets, technology drivers, integrated circuits, packaging and substrate trends that go hand-in-hand with the development of 3D IC and ...

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility: Hwang, Lih–Tyng, Horng, Tzyy–Sheng Jason: Amazon.sg: Books

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility - ISBN: 9781119289678 - (ebook) - von Lih-Tyng Hwang, Tzyy-Sheng Jason Horng, Verlag: Wiley

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

Read "3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility" by Lih-Tyng Hwang available from Rakuten Kobo. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product li...

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

Downloads PDF 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang & Tzyy-Sheng Jason Horng Engineering Books An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Date Published : 2018-03-29 Status : AVAILABLE

3D IC and RF SiPs: Advanced Stacking and Planar Solutions ...

Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan. A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments. Readers are introduced to the markets, technology drivers, integrated circuits, packaging and substrate trends that go hand-in-hand with the development of ...

3D IC and RF SiPs : advanced stacking and planar solutions ...

Main 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility. 3D IC and RF SiPs : advanced stacking and planar solutions for 5G mobility Horng, Tzyy-sheng Jason, Hwang, Lih-Tyng. Year: 2018. Edition: 1st edition. Publisher: John Wiley & Sons. Language: english. Pages: 451. ISBN 10: 1119289645. ISBN 13: 9781119289647. File: PDF, 11.96 MB. Save for later . You may be ...

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. Lih-Tyng Hwang. An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples ...

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability ...

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Buy 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility by Lih-Tyng Hwang, Tzyy-Sheng Jason Horng online at Alibris. We have new and used copies available, in 1 editions - starting at $116.69. Shop now.

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang, 9781119289647, available at Book Depository with free delivery worldwide. We use cookies to give you the best possible experience. By using our website you agree to our use of ...

Lih-Tyng HWANG | Professor and Director | Doctor of ...

Lih-Tyng Hwang In this paper, we first investigated the effects of 3D single and multi-via(s) on power integrity of a packaged IC. Backside vias have been an essential element in MMIC technology.

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Professor Lih-Tyng Hwang explained that a three-dimensional integrated circuit (3D IC) is the computing center of a cellphone, while RF SiPs are responsible for wireless transmission and reception; these are the two most important units in a cellphone. He also said that the book describes technologies for 5G mobility, and presents a unified approach to mass production processes. Mobility means people are free to roam anywhere. The essential elements for 5G mobility are: power saving ...

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Lydi Smaini RF Analog Impairments Modeling for Communication Systems Simulation. Application to OFDM-based Transceivers


With the growing complexity of personal mobile communication systems demanding higher data-rates and high levels of integration using low-cost CMOS technology, overall system performance has become more sensitive to RF analog front-end impairments. Designing integrated transceivers requires a thorough understanding of the whole transceiver chain including RF analog front-end and digital baseband. Communication system engineers have to include RF analog imperfections in their simulation benches in order to study and quantify their impact on the system performance. Here the author explores key RF analog impairments in a transceiver and demonstrates how to model their impact from a communication system design view-point. He discusses the design aspects of the front end of transceivers (both receivers and transmitters) and provides the reader with a way to optimize a complex mixed-signal platform by taking into account the characteristics of the RF/analog front-end. Key features of this book include: Practical examples illustrated by system simulation results based on WiFi and mobile WiMAX OFDM transceivers An overview of the digital estimation and compensation of the RF analog impairments such as power amplifier distortion, quadrature imbalance, and carrier and sampling frequency offsets An exposition of the challenges involved in the design of both RF analog circuits and DSP communication circuits in deep submicron CMOS technology MATLAB® codes for RF analog impairments models hosted on the companion website Uniquely the book bridges the gap between RFIC design specification needs and communication systems simulation, offering readers RF analog impairments modeling knowledge and a comprehensive approach to unifying theory and practice in system modelling. It is of great value to communication systems and DSP engineers and graduate students who design communication processing engines, RF/analog systems and IC design engineers involved in the design of communication platforms.

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Группа авторов Application of IC-MS and IC-ICP-MS in Environmental Research


Introduces the reader to the field of ion chromatography, species analysis and hyphenated methods IC-MS and IC-ICP-MS including the theory and theirs applications Covers the importance of species analysis and hyphenated methods in ion chromatography Includes practical applications of IC-MS and IC-ICP-MS in environmental analysis Details sample preparation methods for ion chromatography Discusses hyphenated methods IC-MS and IC-ICP-MS used in determining both the total element contents and its elements Details speciation analysis used in studying biochemical cycles of selected chemical compounds; determining toxicity and ecotoxicity of elements; food and pharmaceuticals quality control; and in technological process control and clinical analytics

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Jianjun Gao Optoelectronic Integrated Circuit Design and Device Modeling


In Optoelectronic Integrated Circuit Design and Device Modeling, Professor Jianjun Gao introduces the fundamentals and modeling techniques of optoelectronic devices used in high-speed optical transmission systems. Gao covers electronic circuit elements such as FET, HBT, MOSFET, as well as design techniques for advanced optical transmitter and receiver front-end circuits. The book includes an overview of optical communication systems and computer-aided optoelectronic IC design before going over the basic concept of laser diodes. This is followed by modeling and parameter extraction techniques of lasers and photodiodes. Gao covers high-speed electronic semiconductor devices, optical transmitter design, and optical receiver design in the final three chapters. Addresses a gap within the rapidly growing area of transmitter and receiver modeling in OEICs Explains diode physics before device modeling, helping readers understand their equivalent circuit models Provides comprehensive explanations for E/O and O/E conversions done with laser and photodiodes Covers an extensive range of devices for high-speed applications Accessible for students new to microwaves Presentation slides available for instructor use This book is primarily aimed at practicing engineers, researchers, and post-graduates in the areas of RF, microwaves, IC design, photonics and lasers, and solid state devices. The book is also a strong supplement for senior undergraduates taking courses in RF and microwaves. Lecture materials for instructors available at www.wiley.com/go/gao

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Группа авторов Advanced Processing and Manufacturing Technologies for Nanostructured and Multifunctional Materials III


This issue contains 9 papers from The American Ceramic Society’s 40th International Conference on Advanced Ceramics and Composites, held in Daytona Beach, Florida, January 24-29, 2016. This issue includes papers presented in the 10th International Symposium on Advanced Processing and Manufacturing Technologies for Structural and Multifunctional Materials and Systems (Symposium 8), Additive Manufacturing and 3D Printing Technologies (Focused Session 4), and Field Assisted Sintering (Focused Session 5).

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Jia-Shen Hong G. Microstrip Filters for RF / Microwave Applications


Advanced, specialized coverage of microstrip filter design Microstrip Filters for RF/Microwave Applications is the only professional reference focusing solely on microstrip filters. It offers a unique and comprehensive treatment of filters based on the microstrip structure and includes full design methodologies that are also applicable to waveguide and other transmission line filters. The authors include coverage of new configurations with advanced filtering characteristics, new design techniques, and methods for filter miniaturization. The book utilizes numerous design examples to illustrate and emphasize computer analysis and synthesis while also discussing the applications of commercially available software. Other highlights include: Lowpass and bandpass filters Highpass and bandstop filters Full-wave electromagnetic simulation Advanced materials and technologies Coupled resonator circuits Computer-aided design for low-cost/high-volume production Compact filters and filter miniaturization Microstrip Filters for RF/Microwave Applications is not only a valuable design resource for practitioners, but also a handy reference for students and researchers in microwave engineering.

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Sun-mi Hwang Miracle on Cherry Hill

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